November 7, 2026

Infineon’s ENDOPACK Cell embeds 1,200 V SiC MOSFETs in traction inverter PCBs

Infineon’s ENDOPACK Cell embeds 1,200 V SiC MOSFETs in traction inverter PCBs

🌍✨ Infineon’s ENDOPACK Cell embeds 1,200 V SiC MOSFETs in traction inverter PCBs

Why we’re watching: Infineon Technologies has introduced ENDOPACK Cell, which embeds its 1,200 V Automotive Gen2p CoolSiC MOSFETs directly in a printed circuit board (PCB).

ENDOPACK Cell is designed to help automakers develop traction inverters faster and scale them across vehicle platforms. 💚

ENDOPACK is Infineon's new brand for chip-embedding technologies in a range of voltage classes, form factors and applications.

⚡ Why this matters

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🔭 What to watch next

  • 📌 Key signal: Infineon Technologies has introduced ENDOPACK Cell, which embeds its 1,200 V Automotive Gen2p CoolSiC MOSFETs directly in a printed circuit board (PCB).…
  • ✅ Watch for measurable follow-through, not just announcements.
  • 🔎 Share the most practical takeaway with your community.

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Reporting curated for GreenTV. Original reporting via Charged EVs.